Core Technology and Application
Defu Technology
To address the trend of lightweight and thin PCB boards, as well as the low transmission loss characteristics of high-frequency and high-speed circuits, DeFu Technology has developed polymer-based additives. These additives are specifically designed to customize the copper nodules on the surface of copper foils. This technology simultaneously achieves low roughness and sufficient peel strength, making it a key aspect of copper foil manufacturing technology.
In electronic circuit copper foils, the presence of a metal barrier layer can introduce factors that impede signal transmission, which can be further amplified in high-speed PCBs. To address this issue, a low ferromagnetic metal barrier layer has been developed, which helps to reduce signal transmission losses to some extent. By using a low ferromagnetic metal as the barrier layer, the unwanted magnetic interference that could negatively affect signal integrity is minimized, resulting in improved signal transmission performance in high-speed PCB applications.
According to customer demands, a targeted development of silicon coupling agent adaptation technology has been carried out, aiming to enhance the chemical bonding performance between copper foils and various types of high-frequency and high-speed resin substrates.